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The optical connectors for 3D structured light modules use precision machining methods and optimized processes . It is mainly used as an important component in assembly between the lens and the optical diffractive element in the 3D face recognition dot matrix projector.

The surface of the optical substrate is coated with a IR band single-pass film or double-pass film in the near-infrared band to achieve high transmission of incident light in a specific band and deep cut-off in other wavelength. At the same time, the laser cutting process is used to achieve the smallest packaging size which is below millimeters in the application. It is currently mainly used in ToF modules of smartphones.

Optical coating combined with semiconductor process technology to perform micro-nano-level optical processing on the chip, mainly used in a new generation of in under display fingerprint recognition solutions, ultra-thin screen fingerprint modules, and ultimately assembled in 5G smart phones as a end product .

Semiconductor wafer optical solutions, using semiconductor manufacturing processes such as film coating, photoresist coating, photolithography, development, and etching to integrate infrared cut-off film, low-transmission and low-reflection film, color filter layer, Micro Lens layer and other optical path layers into the surface of fingerprint reader. This can be applied to the fingerprint identification module under the ultra-thin displays, replacing the traditional fingerprint identification module, and realizing the ultra-thin and miniaturization of the fingerprint identification module. It is currently applied to 5G smartphones.